Heat transfer behavior of nanoparticle enhanced PCM solidification through an enclosure with V shaped fins

Authors

M Sheikholeslami, Babol Noshirvani University of Technology
Rizwan-ul Haq, Bahria University
Ahmad Shafee, College of Technological Studies, University Tun Hussein Onn
Zhixiong Li, University of Wollongong, Ocean University of ChinaFollow

RIS ID

131824

Publication Details

Sheikholeslami, M., Haq, R., Shafee, A. & Li, Z. (2019). Heat transfer behavior of nanoparticle enhanced PCM solidification through an enclosure with V shaped fins. International Journal of Heat and Mass Transfer, 130 1322-1342.

Abstract

Thermal storage unit can be utilized to satisfy the balance of energy supply and demand. Copper oxide nanoparticles and V shaped fins are involved in storage unit in current research to expedite the solidification. To show the variation of energy storage efficiency, Finite element method has been employed. Important selected parameters are nanofluid concentration, angle of V shaped fin, copper oxide particle size and length of fins. Contours and profiles in various time steps are depicted. Outputs display that discharging rate augments with rise of angle of V shaped fin. Using copper oxide helps solidification. Length of fin has inverse relationship with discharging rate.