Influence of wavy enclosure and nanoparticles on heat release rate of PCM considering numerical study
RIS ID
145544
Abstract
© 2020 Elsevier B.V. The main goal of this attempt is achieving higher rate of solidification with employing two passive techniques. Mixing the based PCM with nanoparticles and considering the wavy shape for walls were two techniques were incorporated. Copper oxide nanomaterial was dispersed in to water with concentration of 0.04 which let us employing homogeneous model. Based on this fact, empirical formulations were utilized for predicting features of NEPCM and various shapes of nano sized particles were considered in thermal conductivity formula. Due to inherent of solidification phenomena, buoyancy can be ignored and pure conduction mechanism with involving the transient source term of solid faction was solved by means of FEM. During the process, the configurations of grids change and the regions around the solid front have finer grid. This opportunity offers outputs with greater accuracy. As shape factor rises, the greater conduction mode can be obtained and similar behavior can be achieved with considering greater amplitude of wavy walls. The best case in term of discharging time is that of m = 5.7 and A = 0.5 in which 156.17 s required to finish the process. Greater amount of shape factor can decrease the time about 5.91% and 5.89% when A = 0.5 and 0.1, respectively. Also, with growth of A, time reduces about 22.66% which indicate better solidification rate. Inclusion of nanoparticles can improve the discharging rate about 17.9%.
Publication Details
Chu, Y., Yadav, D., Shafee, A., Li, Z. & Bach, Q. (2020). Influence of wavy enclosure and nanoparticles on heat release rate of PCM considering numerical study. Journal of Molecular Liquids, 319