Simultaneous grain growth and grain refinement in bulk ultrafine-grained copper under tensile deformation at room temperature

Authors

Hai Liang Yu, University of WollongongFollow
Cheng Lu, University of WollongongFollow
Anh Kiet Tieu, University of WollongongFollow
Hui Jun Li, University of WollongongFollow
Ajit R. Godbole, University of WollongongFollow
Charlie Kong, University of New South Wales (UNSW)
Xing Zhao, University of Wollongong (UOW)Follow

RIS ID

107997

Publication Details

Yu, H., Lu, C., Tieu, A. Kiet., Li, H., Godbole, A., Kong, C. & Zhao, X. (2016). Simultaneous grain growth and grain refinement in bulk ultrafine-grained copper under tensile deformation at room temperature. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 47A 3785-3789.

Abstract

Grain growth and grain refinement behavior during deformation determine the strength and ductility of ultrafine-grained materials. We used asymmetric cryorolling to fabricate ultrafine-grained copper sheets with an average grain width of 230 nm and having a laminate structure. The sheets show a high-true failure strain of 1.5. Observation of the microstructure at the fracture surface reveals that ultrafine laminate-structured grains were simultaneously transformed into both equiaxed nanograins and coarse grains under tensile deformation at room temperature.