Microstructures and properties of wire-arc additively manufactured ultra-high strength aluminum alloy under different heat treatments

Publication Name

Journal of Materials Research and Technology

Abstract

The microstructures, mechanical properties and corrosion behaviors of the ultra-high strength Al–Zn–Mg–Cu-Sc aluminum alloy fabricated by wire-arc additive manufacturing process using a self-prepared 7B55-Sc filler wire were systematically investigated under different heat treatments. The results showed that the microstructures of the as-deposited, T6, T73, and retrogression and re-aging (RRA) heat treatments were all composed of fine equiaxed grains with a size of about 6.0 μm. The grain boundary precipitates (GBPs) of the as-deposited sample were very coarse and continuously distributed along the grain boundaries, and the intragranular precipitates (IGPs) mainly consisted of a small amount of ηMg(Zn,Cu,Al)2 and η′ phases. After T6 heat treatment, the GBPs became much finer, but still continuously distributed along the grain boundaries. The IGPs mainly consisted of fine GP zones and η′ phases. After RRA heat treatment, the GBPs became coarser and discontinuously distributed along the grain boundaries. The IGPs were composed of η′ phases and ηMg(Zn,Cu,Al)2 phases. After T73 heat treatment, the GBPs became much coarser and sparsely distributed along the grain boundaries. The IGPs mainly consisted of coarser ηMg(Zn,Cu,Al)2 phases. The T6 heat-treated sample achieved the highest tensile strength of 618 MPa. While the strength of T73 heat-treated sample was sacrificed by up to 17% compared with the T6 heat-treated sample, but the corrosion resistance was the best of all heat-treated conditions. After RRA heat treatment, the strength was about 10% lower than the strength of the T6 condition, but the corrosion resistance was better than that of the T6 heat-treated sample.

Open Access Status

This publication may be available as open access

Volume

24

First Page

1663

Last Page

1678

Funding Number

2021-YQ-01

Funding Sponsor

Youth Innovation Promotion Association of the Chinese Academy of Sciences

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Link to publisher version (DOI)

http://dx.doi.org/10.1016/j.jmrt.2023.03.100