Title

Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity

RIS ID

121652

Publication Details

Liu, K., Wang, Z., Jiang, Z., Atrens, A., Huang, Z., Guo, W., Zhang, X., Yu, J., Lu, Q. & Lu, D. (2018). Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity. Journal of Materials Engineering and Performance, 27 (3), 933-938.

Abstract

This paper (i) investigated how the microstructure, conductivity, and mechanical properties of Cu-7Cr-0.1Ag microcomposites were changed by cold drawing and subsequent heat treatment, and (ii) produced the Cu-7Cr-0.1Ag microcomposite with an optimum combination of strength and conductivity. The figure of merit Z (combining strength and conductivity) of the Cu-7Cr-0.1Ag microcomposite was larger than that of the microcomposite without silver for each heat treatment. The value of Z of the Cu-7Cr-0.1Ag microcomposite was a maximum after heat treatment for 1 h at 600 °C, indicating that this was the optimum intermediate heat treatment. The following combinations of conductivity, strength and ductility (measured as elongation to fracture) were obtained by the Cu-7Cr-0.1Ag microcomposite with η = 8: (i) 77.9% IACS (International Annealed Copper Standard), 920 MPa and 3.1%; (ii) 79.3% IACS, 880 MPa and 3.3%; and (iii) 79.9% IACS, 798 MPa and 3.5%. These values for the Cu-7Cr-0.1Ag microcomposite were larger than those of the Cu-7Cr microcomposite.

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Link to publisher version (DOI)

http://dx.doi.org/10.1007/s11665-018-3221-1