Publication Details

Yu, H., Tieu, A. Kiet., Lu, C. & Godbole, A. (2014). An investigation of interface bonding of bimetallic foils by combined accumulative roll bonding and asymmetric rolling techniques. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 45A (9), 4038-4045.


The bond strength in bimetallic materials is an important material characteristic. In this study, 0.1-mm thick bimetallic foils (AA1050/AA6061) were produced using one pass of accumulative roll bonding followed by three passes of asymmetric rolling (AR). The AR passes were carried out at roll speed ratios of 1.0, 1.1, 1.2, 1.3, and 1.4 separately. Finite element simulation was used to model the deformation of the bimetallic foils for the various experimental conditions. Particular attention was focused on the bonding of the interface between AA1050 and AA6061 layers in the simulation. The optimization of the roll speed ratio was obtained for improvement of the bond strength of the interface of AA1050/AA6061 bimetallic foils during AR process. In the simulation, the mean equivalent strain at the interface zone between the AA1050 and AA6061 layers was seen to reach a peak value at a roll speed ratio of about 1.2 to 1.3, which also corresponded to a high quality bond at the interface as observed experimentally.



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