Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles
Accumulative roll bonding (ARB) is one of the most promising methods for the industrial production of ultrafine grained (UFG) sheet materials. The poor bond strength is one of the major drawbacks in the ARB process. Degreasing and wire-brushing have been widely adopted in ARB to improve bonding. In this paper, the nano-sized SiO2 particles has been used to enhance the bond strength. The bond strength in our samples exceeds 2.5 times the values achieved by degreasing and wire-brushing methods. In addition, the mechanical properties and microstructures of the ARB-processed samples have also been investigated.
Please refer to publisher version or contact your library.