Title

Simple, low-cost fabrication of semi-circular channel using the surface tension of solder paste and its application to microfluidic valves

RIS ID

125570

Publication Details

Yan, S., Li, Y., Zhu, Y., Liu, M., Zhao, Q., Yuan, D., Yun, G., Zhang, S., Wen, W., Tang, S. & Li, W. (2018). Simple, low-cost fabrication of semi-circular channel using the surface tension of solder paste and its application to microfluidic valves. Electrophoresis, Online First 1-6.

Abstract

This work presents a simple, low-cost method to fabricate semi-circular channels using solder paste, which can amalgamate the cooper surface to form a half-cylinder mold using the surface tension of Sn-Pd alloy (the main component in solder paste). This technique enables semi-circular channels to be manufactured with different dimensions. These semi-circular channels will then be integrated with a polymethylmethacrylate frame and machine screws to create miniaturized, portable microfluidic valves for sequential liquid delivery and particle synthesis. This approach avoids complicated fabrication processes and expensive facilities and thus has the potential to be a useful tool for lab-on-a-chip applications.

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Link to publisher version (DOI)

http://dx.doi.org/10.1002/elps.201800064