Atomic layer deposition of TiO2 and Al2O3 thin films and nanolaminates
RIS ID
83291
Abstract
We have been developing our capability with atomic layer deposition (ALD), to understand the influence of deposition parameters on the nature of TiO2 and Al2O3 films (high and low refractive index respectively), and multilayer stacks thereof (nanolaminates). These stacks have potential applications as anti-reflection coatings and optical filters. This paper will explore the evolution of structure in our films as a function of deposition parameters including temperature and substrate surface chemistry. A broad range of techniques have been applied to the study of these films, including cross-sectional transmission electron microscopy, spectroscopic ellipsometry and secondary-ion mass spectrometry. These have enabled a wealth of microstructural and compositional information on the films to be acquired, such as accurate film thickness, composition, crystallization sequence and orientation with respect to the substrate. The ALD method is shown to produce single-layer films and multilayer stacks with exceptional uniformity and flatness, and in the case of stacks, chemically abrupt interfaces. We are currently extending this technology to the coating of polymeric substrates.
Publication Details
Mitchell, D. RG., Triani, G., Attard, D. J., Finnie, K., Evans, P. J., Barbe, C. and Bartlett, J. R. (2006). Atomic layer deposition of TiO2 and Al2O3 thin films and nanolaminates. Smart Materials Structures, 15 (1), S57-S64.