Title

Fabrication of silver stabilization layer of coated conductor using organic silver complexes

RIS ID

33921

Publication Details

Lee, JB, Park, S, Kim, S, Moon, S, Lee, H, Kim, J, Dou, SX & Hong, GW (2010), Fabrication of silver stabilization layer of coated conductor using organic silver complexes, In Proceedings of the 22nd International Symposium on Superconductivity, 2-4 Nov 2009, Tsukuba, Japan, Physica C: Superconductivity and its Applications, 470(20), pp. 1338-1341.

Abstract

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt.% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at 500 °C showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as 0.67 × 10−13 Ω m2. Additional protecting copper layer with the thickness of 20 μm was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ∼140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

Grant Number

ARC/DP0770205

Please refer to publisher version or contact your library.

Share

COinS
 

Link to publisher version (DOI)

http://dx.doi.org/10.1016/j.physc.2010.05.107